Interfoam - Notice of Schedule Adjustment for 2022 and Annual Plan for 2023
Interfoam China (Shanghai) will be held on June 14-16, 2023, and the venue will remain unchanged.
Interfoam South China (Shenzhen) will be held in December, 2023, and the venue will remain unchanged.
Sub-forums | Innovative Application and Solutions of Foam Materials in ①New Energy Vehicles & ②Industry, High-end Manufacturing, Clean Energy.
Topics of "Redefine Foams" Sub-forums
Topics | Innovation Development of Foaming Technology, Raw Materials and Foaming Agents
With the theme of "Redefine Foams", we will focus on building Expert Lecture, Sustainable Development, Foaming Technology & Process related theme forums. In addition, there will be sub-forums on the application of foam materials such as new energy vehicles, green packaging, industrial & high-end manufacturing (semiconductor, 5G base station, photovoltaic, aerospace), with a total of 48 topics. The forums will be held online and offline simultaneously.
Interfoam China 2022 - Notice of Postponement - Final
【new schedule】Interfoam China 2022 will be held on November 14-16, 2022 at Shanghai New International Expo Center (SNIEC) - Hall E6
Interfoam 2022 Notification of New Date
According to the latest scheduling plan given by thevenue,the new holding time of Interfoam2022 Shanghai exhibition is from August 31 toSeptember 2,2022, and the venue remains unchanged, still at Shanghai New International ExpoCenter -Hall E7.The established service contents and work plans of the exhibition will bepostponed simultaneously.
Interfoam China 2022 - Notice of Postponement
Due to the epidemic and after careful consideration, we organizer has decided that the "Interfoam China 2022" originally scheduled to be held on July 6-8, 2022 at Shanghai New International Expo Center, will be postponed. The specific time and place will be announced later!
Innovative Foaming Process Leads PLA Foams towards Industrialization
PLA heat-resistant tableware will become more practical, and foaming is an effective approach to process PLA at low cost. The rise of E-PLA tableware begins to meet people's need for a quick meal, and dramatically stimulates the growth of the biodegradable plastic market.
Rigid Polyurethane Foam Polishing Pads, Pad Products for Improving Semiconductor Integration
Chemical Mechanical Polishing (CMP) is currently the only technology capable of achieving both overall and partial planarization, enabling chipmakers to further reduce circuit areas and improve the performance of lithography tools. For polishing process, the two most crucial materials are polishing liquid and polishing pads.
Rigid Foam Core Materials ｜ Structural Core for light-weight Components and Applications in Extreme Environments
Foam core materials are widely applied in sandwich-structured composite materials with its unique properties, showing robust "hard core" strength in such industries as green building, automobile, aerospace, marine, wind energy, and sports, thus laying a solid foundation of high-performance materials for the development of the national economy.